BAM 418 Product Assembly Hot Melt Adhesive

Product overview

BAM 418 is ideal for a wide variety of applications where a high speed, very fast setting hot melt adhesive is required. BAM 418 has a versatile temperature performance. This enables it to be used if high heat resistance is required, such as in microwaves and markets where hot climates may be encountered, as well as in deep freeze applications -where it has been successfully tested down to -30°C on untreated boards. In addition, BAM 418 has low odour, excellent thermal stability and good gap filling capabilities.

Applications

BAM 418 is widely used in packaging applications for tray forming, top and bottom case sealing, carton sealing.  Its viscosity makes it particularly suitable for wraparound case sealing.

BAM 418 can also be used in some lightweight assembly applications and has been successful in pocket spring mattress applications.

Application method

BAM 418 should be applied at 150°C to 170°C depending upon substrates to be bonded.

Storage

Store in a clean dry place at temperatures between 5 and 30ºC with containers kept closed. Use oldest stock first.