Permabond ET5411 High Temperature Epoxy Adhesive

Product Overview

PERMABOND ET5411 is a thermally conductive two-component adhesive based on epoxy resin. It is specifically designed to bond metal substrates when excellent resistance to high temperature is required. The full cure is achieved in 7 days at room temperature, but it can be obtained in 24 hours at room temperature followed by 30 minutes at +80°C(176°F). Permabond ET5411 provides excellent resistance to motor oil, glycol and hot and cold water.

Featured Properties

• Full cure at room temperature
• Adhesion to a variety of substrates
• Thermally conductive
• High temperature resistance
• Excellent chemical resistance

Storage

Storage Temperature - 5 to 25°C (41 to 77°F)

Surface Preparation

Surfaces should be clean, dry and grease-free before applying the adhesive. Use a suitable solvent (such as acetone or isopropanol) for the degreasing of surfaces. Some metals such as aluminium, copper and its alloys will benefit from light abrasion with emery cloth (or similar), to remove the oxide layer.

Directions for Use

1.Dual cartridges:

• a) Insert the cartridge into the application gun and guide the plunger into the cartridge.
• b) Remove the cartridge cap and dispense material until both sides are flowing.
• c) Attach the static mixer to the end of the cartridge and begin dispensing the material.

2.Apply material to one of the substrates.

3.Join the parts. Parts must be joined within 2 hoursof mixing the two epoxy components.

4.Large quantities and/or higher temperature will decrease the usable life or pot life.

5.Apply pressure to the assembly by clamping for at least 4 hoursuntil handling strength is obtained.

6.Full cure will be obtained after 7 daysat 23°C(73°F). Heat can be used to accelerate the curing process.

NB. Exercise caution when mixing large quantities due to exothermic reaction.