Permabond ET5429 Composite Bonding Epoxy Adhesive

Product Overview

PERMABOND ET5429 is a thixotropic two-part adhesive with excellent resistance to impact and vibration. The controlled flow properties as well as its ease of mixing and application, enables the adhesive to be used where gap filling or vertical application is required. Permabond ET5429 has been found to provide exceptional performance even at elevated temperatures. It is ideal for use in construction of composite assemblies.

Featured Properties

• Ideal for bonding composite materials
• Easy to apply
• High shear and peel strength
• Good impact strength
• High temperature resistance

Storage

Storage Temperature - 5 to 25°C (41 to 77°F)

Surface Preparation

Surfaces should be clean, dry and grease-free before applying the adhesive. Use a suitable solvent (such as acetone or isopropanol) for the degreasing of surfaces. Some metals such as aluminium, copper and itsalloys will benefit from light abrasion with emery cloth (or similar), to remove the oxide layer.

Directions for Use

1.Dual cartridges:

• a) Insert the cartridge into the application gun and guide the plunger into the cartridge.
• b) Remove the cartridge cap and dispense material until both sides are flowing.
• c) Attach the static mixer to the end of the cartridge and begin dispensing the material.

2.Apply material to one of the substrates.

3.Join the parts. Parts must be joined within 2-4 hoursof mixing the two epoxy components.

4.Large quantities and/or higher temperature will decrease the usable life or pot life.

5.Apply pressure to the assembly by clamping for 6-10 hoursor until handling strength is obtained.

6.Full cure will be obtained after 72 hours at 25°C (77°F). Heat can be used to accelerate the curing process.