Woodstikk PU Rapid Gel D4 Polyurethane Adhesive

PRODUCT OVERVIEW

Woodstikk® PU Rapid Gel D4 has been formulated for high performance water-resistant bonds between a wide range of materials.

The thixotropic nature of the gel prevents slumping and gives a level of gap filling to the bond. Woodstikk® PU Rapid Gel D4 has excellent adhesion to wood, chipboard, polyurethane, mineral wool, concrete, stone, bricks, gypsum boards and all traditional porous substrates and van be used in a wide range of bonding applications. Woodstikk® PU Rapid Gel D4 is ideal for all types of wood bonding and joinery, bonding wooden constructions, boats, jointing sandwich panels, and insulation as well as many other applications.

SIZES AVAILABLE

300ml cartridge (35 linear metre coverage)

Featured Properties

• Non-slumping, ready to use, gel
• Solvent free
• Totally non flammable
• Bonds skirting boards and stair treads
• Fully waterproof to EN 204 D4
• High performance bonds between a wide range of materials
• Excellent weathering and aging properties
• Foams slightly to fill gaps
• Excellent chemical resistance

PREPARATION AND APPLICATION

At least one of the surfaces to be bonded must be porous and ensure surfaces are always clamped during cure.

Firstly cut tip of the cartridge and screw on the nozzle. Cut nozzle to an angle of 45 degrees. Apply the adhesive, using a standard cartridge gun, to one of the surfaces to be bonded and assemble the bond immediately (within 5 minutes). Apply pressure to the bond, by means of a clamp. The product will foam slightly on application to fill any small gaps. Clean away any excess adhesive immediately.

Under normal conditions the gel will skin over after approximately 5 minutes and give a handleable cure within 10 minutes and final bond strength acheived in 12 hours.

Handling and Storage

The product should be stored unopened in a dry condition at a temperature of 10 - 25°C. This will ensure the stated shelf-life of 12 months. The adhesive will have a limited life once the container is opened.